The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2015
Filed:
Mar. 13, 2002
Applicants:
Andrew Mcintosh Soutar, London, GB;
Peter Thomas Mcgrath, Mission Viejo, CA (US);
Inventors:
Andrew McIntosh Soutar, London, GB;
Peter Thomas McGrath, Mission Viejo, CA (US);
Assignee:
Enthone Inc., West Haven, CT (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 5/12 (2006.01); B05D 1/18 (2006.01); C04B 41/51 (2006.01); C23C 18/40 (2006.01); H05K 3/24 (2006.01); C23C 18/42 (2006.01);
U.S. Cl.
CPC ...
H05K 3/244 (2013.01); B05D 5/12 (2013.01); C23C 18/42 (2013.01); Y10T 29/4913 (2015.01); Y10T 29/49144 (2015.01);
Abstract
A process used during manufacture of printed circuit boards comprises protecting metal pads and/or through-holes to provide a tarnish-resistant and solderable coating. In the method, the pads and/or through-holes are bright-etched, metal plated, preferably by an immersion process, and treated with a tarnish inhibitor. The tarnish inhibitor may be incorporated into the immersion plating bath. The metal plating is usually with silver or bismuth and the pads and/or through-holes comprise copper.