The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2015

Filed:

Mar. 12, 2012
Applicant:

Matthew J. Holcomb, Metamora, MI (US);

Inventor:

Matthew J. Holcomb, Metamora, MI (US);

Assignee:

Grid Logic Incorporated, Metamora, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F25B 9/00 (2006.01); H05K 7/20 (2006.01); F25B 9/02 (2006.01); F25B 9/14 (2006.01); H01L 39/16 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20372 (2013.01); Y10T 29/49359 (2015.01); Y10T 29/49002 (2015.01); H01L 39/16 (2013.01); F25B 9/02 (2013.01); F25B 9/145 (2013.01);
Abstract

The invention provides a variable impedance device including a first bus bar refrigeration system, a first bus bar thermally connected to the first bus bar refrigeration system to be maintained at a target bus bar temperature by the first bus bar refrigeration system, a variable impedance component refrigeration system, a variable impedance component electrically connected to the first bus bar and thermally connected to the component refrigeration system, a variable impedance component may be at least partially made of a material that is superconducting below a critical temperature and may be maintained at a target component temperature, wherein the target bus bar temperature may be between the 300K and critical temperature and the target component temperature may be below the critical temperature and a second bus bar connected to the variable impedance component so that current flows between the first and second leads through the variable impedance component.


Find Patent Forward Citations

Loading…