The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2015
Filed:
Feb. 28, 2014
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Tae-Young Yoon, Hwaseong-si, KR;
Abstract
A package substrate may include an insulating substrate, a first land array, a second land array, a first plating line and a second plating line. The first land array may be arranged on a first surface of the insulating substrate. The second land array may be arranged on a second surface of the insulating substrate opposite to the first surface. The second land array may be electrically connected to the first land array. The second land array may include outer lands and inner lands. The first plating line may be connected to the outer lands. The second plating line may be connected between the outer lands and the inner lands. The second plating line may have a width narrower than that of the first plating line. The second plating line may be removed by applying a removing current to the first plating line prior to the first plating line.