The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2015

Filed:

Nov. 19, 2010
Applicants:

Matthew Finley, Haddonfield, NJ (US);

John Perkins, Wilmington, MA (US);

Peter Z. Torok, Brockport, NY (US);

Robert H. Foster, Newburyport, MA (US);

Robert Cowperthwait, Millville, NJ (US);

John H. Beswick, Williamson, NY (US);

David Inman, Acton, MA (US);

Inventors:

Matthew Finley, Haddonfield, NJ (US);

John Perkins, Wilmington, MA (US);

Peter Z. Torok, Brockport, NY (US);

Robert H. Foster, Newburyport, MA (US);

Robert Cowperthwait, Millville, NJ (US);

John H. Beswick, Williamson, NY (US);

David Inman, Acton, MA (US);

Assignee:

Parker-Hannifin Corporation, Cleveland, OH (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0005 (2013.01);
Abstract

An integrated assembly is provided for installation on a housing for electronic components. The integrated assembly includes a shielded window and a bezel overmolded onto the shielded window in an injection molding process. Since both the shielded window and the bezel have EMI resistant properties, the assembly represents an efficient method for providing high quality EMI shielding while eliminating the use of costly parts and assembly procedures.


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