The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2015

Filed:

Jan. 18, 2013
Applicant:

Hitachi Cable, Ltd., Tokyo, JP;

Inventors:

Hiroki Yasuda, Mito, JP;

Yoshinori Sunaga, Hitachinaka, JP;

Kouki Hirano, Hitachinaka, JP;

Juhyun Yu, Mito, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 6/12 (2006.01); H04B 10/25 (2013.01); B29D 11/00 (2006.01); G02B 6/42 (2006.01); H04B 10/80 (2013.01);
U.S. Cl.
CPC ...
H04B 10/2504 (2013.01); Y10T 29/49002 (2015.01); G02B 6/428 (2013.01); G02B 6/4284 (2013.01); G02B 6/12 (2013.01); G02B 6/42 (2013.01); G02B 6/4281 (2013.01); H04B 10/80 (2013.01); H04B 10/25 (2013.01); H04B 10/801 (2013.01); B29D 11/00 (2013.01); G02B 6/4214 (2013.01); G02B 6/423 (2013.01);
Abstract

An optical module includes a circuit board having flexibility, a photoelectric conversion element mounted on a mounting surface of the circuit board, a semiconductor circuit element mounted on the mounting surface of the circuit board and electrically connected to the photoelectric conversion element, a plate-shaped optical connection member having a groove into which an end part of an optical fiber is pushed so as to be housed and optically connecting the optical fiber and the photoelectric conversion element, and a supporting member arranged so as to sandwich the optical connection member between the circuit board. The groove is formed between the semiconductor circuit element and the supporting member so as to have an opening into which the optical fiber is pushed at the supporting member side. The semiconductor circuit element has a height from the mounting surface of the circuit board higher than the photoelectric conversion element.


Find Patent Forward Citations

Loading…