The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2015

Filed:

May. 21, 2013
Applicant:

Tyco Electronics Corporation, Berwyn, PA (US);

Inventors:

Steven Lee Flickinger, Hummelstown, PA (US);

Evan Charles Wickes, Harrisburg, PA (US);

James Charles Shiffler, Hummelstown, PA (US);

John L. Broschard, Hershey, PA (US);

Steve Douglas Sattazahn, Lebanon, PA (US);

Assignee:

TYCO ELECTRONICS CORPORATION, Berwyn, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/02 (2006.01); H01R 4/48 (2006.01); H01R 4/10 (2006.01); H01R 13/11 (2006.01); H01R 43/16 (2006.01);
U.S. Cl.
CPC ...
H01R 4/48 (2013.01); H01R 4/10 (2013.01); H01R 13/113 (2013.01); H01R 43/16 (2013.01);
Abstract

Power connector including a pair of discrete contact springs configured to electrically engage a conductive component. Each of the contact springs includes a contact body having opposite inner and outer side surfaces and a contact edge that extends between the inner and outer side surfaces. The contact body is shaped to form a spring base and a mating portion. The spring bases of the contact springs are joined by a locking feature. The locking feature includes a localized portion of at least one of the spring bases. The localized portion frictionally engages the other spring base to interlock the spring bases. Each of the mating portions extends from the corresponding spring base. The mating portions are separated by a receiving space and are configured to engage the conductive component when the conductive component is inserted into the receiving space.


Find Patent Forward Citations

Loading…