The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2015

Filed:

May. 21, 2014
Applicant:

Daniel R. Shepard, North Hampton, NH (US);

Inventor:

Daniel R. Shepard, North Hampton, NH (US);

Assignee:

CONTOUR SEMICONDUCTOR, INC., North Billerica, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 45/00 (2006.01); H01L 27/24 (2006.01); H01L 21/28 (2006.01); H01L 29/788 (2006.01);
U.S. Cl.
CPC ...
H01L 45/1683 (2013.01); H01L 45/06 (2013.01); H01L 21/28273 (2013.01); H01L 29/788 (2013.01); H01L 45/1233 (2013.01); H01L 45/1246 (2013.01); H01L 45/144 (2013.01); H01L 27/2409 (2013.01); H01L 45/1608 (2013.01);
Abstract

The present invention is a method for forming a vertically oriented element having a narrower area near its center away from either end. The present invention will find applicability in other memory cell structures. The element will have a narrow portion towards its center such that current density will be higher away from the ends of the element. In this way, the heating will occur away from the ends of the storage element. Heating in a phase-change or resistive change element leads to end of life conditions, including the condition whereby contaminants from the end point contacts are enabled to migrate away from the end point and into the storage element thereby contaminating the storage element material and reducing its ability to be programmed, erased and/or read back. By keeping the greatest heating towards the center of the element where it is surrounded by more of the same material and away from the ends of the element where end point contact material can be heated and potentially activated, the lifetime of the element will be increased.


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