The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2015
Filed:
Sep. 13, 2011
Applicants:
Frank Moellmer, Matting bei Pentling, DE;
Markus Arzberger, Regensburg, DE;
Michael Schwind, Sinzing, DE;
Thomas Hoefer, Lappersdorf, DE;
Inventors:
Frank Moellmer, Matting bei Pentling, DE;
Markus Arzberger, Regensburg, DE;
Michael Schwind, Sinzing, DE;
Thomas Hoefer, Lappersdorf, DE;
Assignee:
OSRAM OPTO SEMICONDUCTORS GMBH, Regensburg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 33/62 (2010.01); H01L 33/48 (2010.01); H01S 5/022 (2006.01); H01L 33/64 (2010.01); H01S 5/024 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 33/48 (2013.01); H01L 33/486 (2013.01); H01S 5/02272 (2013.01); H01L 33/483 (2013.01); H01L 33/647 (2013.01); H01S 5/02212 (2013.01); H01S 5/0226 (2013.01); H01S 5/02276 (2013.01); H01S 5/02469 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73265 (2013.01);
Abstract
A package for an optoelectronic semiconductor component is disclosed. The package includes a package body, a first connecting lead and a second connecting lead. The first connecting lead and the second connecting lead each extend in a vertical direction through the package body. A semiconductor component with such a package and a semiconductor chip are also disclosed.