The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2015

Filed:

Jan. 14, 2014
Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Toshiyuki Ozai, Takasaki, JP;

Masanari Moteki, Annaka, JP;

Masayuki Ikeno, Maebashi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 143/04 (2006.01); H01L 23/29 (2006.01); H01L 33/56 (2010.01);
U.S. Cl.
CPC ...
H01L 33/56 (2013.01); C09J 143/04 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/8592 (2013.01); C08L 2312/08 (2013.01);
Abstract

The invention provides a primer composition which adheres a substrate mounting an optical semiconductor device and a cured material of an addition reaction curing silicone composition that encapsulates the optical semiconductor device includes (A) an acrylic resin containing either one or both of an acrylate ester and a methacrylate ester that contains one or more SiCH═CHgroups in the molecule, and (B) solvent. There can be provided a primer composition in which the adhesion between a substrate mounting an optical semiconductor device and a cured material of an addition reaction curing silicone composition that encapsulates the optical semiconductor device can be improved, the corrosion of a metal electrode formed on the substrate can be prevented, and the heat resistance of a primer itself can be improved.


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