The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2015

Filed:

Mar. 09, 2009
Applicants:

Hiroshi Katsuno, Tokyo, JP;

Yasuo Ohba, Kanagawa-ken, JP;

Kei Kaneko, Kanagawa-ken, JP;

Mitsuhiro Kushibe, Tokyo, JP;

Inventors:

Hiroshi Katsuno, Tokyo, JP;

Yasuo Ohba, Kanagawa-ken, JP;

Kei Kaneko, Kanagawa-ken, JP;

Mitsuhiro Kushibe, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/44 (2010.01); H01L 33/38 (2010.01);
U.S. Cl.
CPC ...
H01L 33/44 (2013.01); H01L 33/38 (2013.01); H01L 2224/13 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01);
Abstract

A semiconductor light-emitting device includes: a laminated structure, a first electrode, a second electrode and a dielectric laminated film. The laminated structure includes, a first semiconductor layer, a second semiconductor layer, and a light-emitting layer provided between the first semiconductor layer and the second semiconductor layer, in which the second semiconductor layer and the light-emitting layer are selectively removed and a part of the first semiconductor layer is exposed to a first main surface on the side of the second semiconductor layer. The first electrode is provided on the first main surface of the laminated structure and connected to the first semiconductor layer and has a first region including a first metal film provided on the first semiconductor layer of the first main surface, and a second region including a second metal film provided on the first semiconductor layer and having a higher reflectance for light emitted from the light-emitting layer than the first metal film and having a higher contact resistance with respect to the first semiconductor layer than the first metal film. The second electrode is provided on the first main surface of the laminated structure and connected to the second semiconductor layer. The dielectric laminated film is provided on the first and second semiconductor layer being not covered with the first and second electrode and has a plurality of dielectric films having different refractive indices being laminated.


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