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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9070700 B1

PDFFull Text
Date of Patent:
Jun. 30, 2015

Filed:

Mar. 30, 2012

Apparatus for electrostatic discharge protection and noise suppression in circuits

Applicants:

Nikolaos Haralabidis, Athens, GR;

Ioannis Kokolakis, Holargos, GR;

Inventors:

Nikolaos Haralabidis, Athens, GR;

Ioannis Kokolakis, Holargos, GR;

Assignee:

Broadcom Corporation, Irvine, CA (US);

Attorney:

Sterne, Kessler, Goldstein & Fox P.L.L.C.

Primary Examiner:

Zeev V Kitov

Int. Cl.
CPC ...
H02H 3/20 (2006.01); H01L 23/60 (2006.01); H02H 9/04 (2006.01); H01L 27/02 (2006.01); H01L 25/00 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/60 (2013.01); H01L 25/00 (2013.01); H02H 3/20 (2013.01); H02H 9/04 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/14 (2013.01); H01L 2224/48091 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 27/0255 (2013.01); H01L 27/0292 (2013.01);
Abstract

An integrated circuit assembly is provided that includes an integrated circuit (IC) package substrate including a package ground rail that is divided into a plurality of segments that are electrically isolated from each other. An IC die is disposed on the IC package substrate, the IC die including a plurality of circuit blocks and an IC ground rail. The IC ground rail is divided into a plurality of segments, where each segment of the IC ground rail is coupled to another segment of the IC ground rail by one or more diodes. The plurality of circuit blocks have corresponding ground nodes electrically connected to corresponding segments of the IC ground rail. The segments of the IC ground rail are electrically coupled to corresponding segments of the package ground rail by corresponding first connections.

Find Patent Forward Citations

Haralabidis, Nikolaos. (2015). Apparatus for electrostatic discharge protection and noise suppression in circuits (U.S. Patent No. 9070700). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9070700

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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