The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2015
Filed:
Sep. 11, 2012
Applicants:
Roel Daamen, Herkenbosch, NL;
Hendrik Bouman, Nijmegen, NL;
Coenraad Cornelis Tak, Waalre, NL;
Inventors:
Assignee:
NXP, B.V., Eindhoven, NL;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/14 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); G01N 27/12 (2006.01); G01D 11/24 (2006.01);
U.S. Cl.
CPC ...
H01L 23/564 (2013.01); H01L 23/315 (2013.01); H01L 23/3157 (2013.01); H01L 21/565 (2013.01); G01N 27/121 (2013.01); G01D 11/245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2924/1815 (2013.01); H01L 2924/3025 (2013.01);
Abstract
An integrated circuit package for an integrated circuit having one or more sensor elements in a sensor element area of the circuit. An encapsulation covers bond wires but leaves an opening over the sensor element area. A protection layer is provided over the integrated circuit over which the encapsulation extends, and it has a channel around the sensor element area to act as a trap for any encapsulation material which has crept into the opening area.