The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2015

Filed:

Jun. 20, 2013
Applicants:

Jason R. Fender, Chandler, AZ (US);

Ngai Ming Lau, Fountain Hills, AZ (US);

Inventors:

Jason R. Fender, Chandler, AZ (US);

Ngai Ming Lau, Fountain Hills, AZ (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 27/08 (2006.01); H01L 29/66 (2006.01); H01L 23/522 (2006.01); G01R 19/00 (2006.01); H01L 21/768 (2006.01); H01L 23/58 (2006.01); H01L 21/66 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/522 (2013.01); G01R 19/0092 (2013.01); H01L 21/768 (2013.01); H01L 2924/1306 (2013.01); H01L 23/585 (2013.01); H01L 24/06 (2013.01); H01L 24/48 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/06134 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/1423 (2013.01); H01L 22/34 (2013.01);
Abstract

An electronic apparatus includes a semiconductor substrate, outer and inner guard rings disposed along a periphery of the semiconductor substrate, and first and second contact pads electrically coupled to the outer and inner guard rings, respectively. The outer and inner guard rings are electrically coupled to one another to define a conduction path between the first and second contact pads. Each of the outer and inner guard rings includes an Ohmic metal layer having a plurality of gaps and further includes conductive bridges across the gaps. The gaps of the outer guard ring are laterally offset from the gaps of the inner guard ring such that the Ohmic metal layers of the outer and inner guard rings laterally overlap.


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