The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2015
Filed:
Jan. 15, 2013
Freescale Semiconductor, Inc., Austin, TX (US);
Tab A. Stephens, Austin, TX (US);
Michael B. McShane, Austin, TX (US);
Perry H. Pelley, Austin, TX (US);
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
A microelectronic assembly () and a microelectronic device () include a stacked structure (). The stacked structure includes a heat spreader (), at least one die () thermally coupled to at least a portion of one side of the heat spreader, at least one other die () thermal coupled to at least a portion of an opposite side of the heat spreader, at least one opening () in the heat spreader located in a region of between the two die, an insulator () disposed in the at least one opening, and electrically conductive material () in an insulated hole () in the insulator. The heat spreader allows electrical communication between the two die through the opening while the insulator isolates the electrically conductive material and the heat spreader from each other.