The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2015
Filed:
Mar. 06, 2012
Applicants:
Tsuyoshi Yoda, Matsumoto, JP;
Nobuaki Hashimoto, Suwa, JP;
Inventors:
Tsuyoshi Yoda, Matsumoto, JP;
Nobuaki Hashimoto, Suwa, JP;
Assignee:
Seiko Epson Corporation, , JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 31/115 (2006.01); H01L 21/44 (2006.01); H01L 23/31 (2006.01); H01L 31/0224 (2006.01); H01L 21/768 (2006.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3114 (2013.01); H01L 31/022408 (2013.01); H01L 21/76898 (2013.01); H01L 27/14636 (2013.01); H01L 27/14649 (2013.01); H01L 27/14692 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A via hole is formed on a base substrate before a device circuit is formed, and thermal oxidation is performed to form a thermal oxidation layer on a surface of the base substrate on which the device circuit is formed and a surface in the via hole. The device circuit having a conductive section is formed on the base substrate after the thermal oxidation, and then, a conductive body is embedded in the via hole.