The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2015

Filed:

Nov. 02, 2011
Applicant:

Kazutaka Manabe, Tokyo, JP;

Inventor:

Kazutaka Manabe, Tokyo, JP;

Assignee:

PS4 LUXCO S.A.R.L., Luxembourg, LU;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 27/108 (2006.01);
U.S. Cl.
CPC ...
H01L 27/10855 (2013.01); H01L 27/10808 (2013.01); H01L 27/10823 (2013.01); H01L 27/10876 (2013.01);
Abstract

A semiconductor device includes the following elements. A semiconductor substrate includes an isolation region. The semiconductor substrate has a groove in the isolation region. A pad electrode is disposed in the groove. A pad contact plug is disposed in the groove. The pad contact plug is disposed on the pad electrode. A gate contact plug is disposed on the pad contact plug. The gate contact plug is electrically coupled through the pad contact plug to the pad electrode. An insulating side wall is disposed in the groove. The insulating side wall covers side surfaces of the pad contact plug and a lower portion of the gate contact plug, and the insulating side wall covers a part of an upper surface of the pad electrode.


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