The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2015
Filed:
Feb. 16, 2011
Sidharth Dalmia, Friar Oaks, CA (US);
Spencer Viray, Sacramento, CA (US);
Lee Harrison, El Dorado Hills, CA (US);
Jess Kerlin, Davis, CA (US);
Khanh Nguyen, Davis, CA (US);
Steven R. Kubes, El Dorado Hills, CA (US);
Sidharth Dalmia, Friar Oaks, CA (US);
Spencer Viray, Sacramento, CA (US);
Lee Harrison, El Dorado Hills, CA (US);
Jess Kerlin, Davis, CA (US);
Khanh Nguyen, Davis, CA (US);
Steven R. Kubes, El Dorado Hills, CA (US);
TYCO ELECTRONICS CORPORATION, Berwyn, PA (US);
Abstract
A method for manufacturing a planar electronic device includes applying a non-conductive fluid polymer to a lower side of a planar substrate. The substrate includes a hole extending through the substrate. The method also includes curing the fluid polymer to form a solid centering layer on the lower side of the substrate, with the centering layer extending across the hole along the lower side of the substrate. The method further includes loading a ferrite material body into the hole of the substrate through the upper side of the substrate, embedding the ferrite material body in an encapsulating material in the hole, and forming one or more conductive loops around the ferrite material body. The ferrite material body is held within the substrate between the lower side and the upper side of the substrate by the encapsulating material.