Multi-chip package semiconductor memory device

Abstract

An MCP type semiconductor memory device having a defective cell remedy function, enables easy design and manufacture while minimizing chip area increase. The semiconductor memory device includes memory chips and a memory controller chip that designates an address of a memory chip according to an access request received from outside and controls access to the designated address. Each memory chip includes first and second storage regions and an information holder that holds address information representing associations between addresses in the first and second storage regions. The memory controller chip includes an address translating part that performs, upon receiving a request to access a specific address in the first storage region indicated by the address information, address designation by translating the specific address in the first storage region to an address in the second storage region corresponding to the specific address based on the associations represented by the address information.