The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2015
Filed:
Mar. 04, 2014
Applicant:
Panasonic Corporation, Osaka, JP;
Inventors:
Shingo Yoshioka, Osaka, JP;
Hiroaki Fujiwara, Nara, JP;
Hiromitsu Takashita, Osaka, JP;
Tsuyoshi Takeda, Osaka, JP;
Assignee:
PANASONIC CORPORATION, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/04 (2006.01); G11B 5/48 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/18 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/66 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/14 (2006.01);
U.S. Cl.
CPC ...
G11B 5/486 (2013.01); H01L 2224/24146 (2013.01); H01L 2924/12044 (2013.01); H01L 22/12 (2013.01); H01L 23/3121 (2013.01); H01L 21/565 (2013.01); H01L 24/24 (2013.01); H01L 24/25 (2013.01); H01L 24/48 (2013.01); H01L 24/82 (2013.01); H01L 24/83 (2013.01); H01L 25/0655 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); H05K 3/184 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/24011 (2013.01); H01L 2224/2405 (2013.01); H01L 2224/24051 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/24226 (2013.01); H01L 2224/245 (2013.01); H01L 2224/25175 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/82039 (2013.01); H01L 2224/82101 (2013.01); H01L 2224/82931 (2013.01); H01L 2224/82947 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/85 (2013.01); H01L 2224/92244 (2013.01); H01L 2924/00015 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01011 (2013.01); H01L 2924/01012 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/0102 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/0103 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01042 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01051 (2013.01); H01L 2924/01056 (2013.01); H01L 2924/01057 (2013.01); H01L 2924/01058 (2013.01); H01L 2924/01075 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/014 (2013.01); H01L 2924/09701 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/14 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19043 (2013.01); H05K 2201/0376 (2013.01); H05K 2201/09472 (2013.01); H01L 2225/06565 (2013.01); H01L 2225/06524 (2013.01); H01L 2225/06551 (2013.01); H01L 2924/12041 (2013.01); H01L 2224/82009 (2013.01); H05K 2203/1461 (2013.01); H01L 2924/1461 (2013.01); H01L 2224/82399 (2013.01); H01L 23/49866 (2013.01); H01L 24/32 (2013.01); H01L 2224/73267 (2013.01); H01L 2924/15798 (2013.01); H01L 2924/3862 (2013.01); H01L 2224/82385 (2013.01); H01L 2924/386 (2013.01); H01L 23/145 (2013.01); H01L 21/4846 (2013.01);
Abstract
One aspect of the present invention is a three-dimensional structure in which a wiring is formed on a surface, the three-dimensional structure having an insulating resin layer that contains a filler formed from at least one element selected from typical non-metal elements and typical metal elements, wherein a recessed gutter for wiring is formed on a surface of the insulating resin layer, and at least a part of a wiring conductor is embedded in the recessed gutter for wiring.