The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2015
Filed:
Aug. 27, 2012
Radio frequency identification (rfid) tag for an item having a conductive layer included or attached
Applicant:
Curt Carrender, Morgan Hill, CA (US);
Inventor:
Curt Carrender, Morgan Hill, CA (US);
Assignee:
Ruizhang Technology Limited Company, Shanghai, CN;
Primary Examiner:
Int. Cl.
CPC ...
G08B 13/14 (2006.01); G06K 19/07 (2006.01); G06K 19/077 (2006.01); G08B 13/24 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
G06K 19/0723 (2013.01); Y10T 29/49128 (2015.01); Y10T 29/49016 (2015.01); Y10T 29/49155 (2015.01); G06K 19/07788 (2013.01); G08B 13/2417 (2013.01); G08B 13/2437 (2013.01); G08B 13/2445 (2013.01); H01L 24/24 (2013.01); H01L 24/82 (2013.01); H01L 2224/24227 (2013.01); H01L 2224/7665 (2013.01); H01L 2224/82039 (2013.01); H01L 2224/95085 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01075 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15155 (2013.01); H01L 2924/15165 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/014 (2013.01);
Abstract
An RFID device. The device comprises a conductive layer formed on a first substrate. An opening line (or two or more opening lines) is formed in the conductive layer to make the conductive layer a part of an antenna structure. An integrated circuit chip is placed over at least a portion the opening line and coupled to the conductive layer. The integrated circuit chip is electrically interconnected to the conductive layer.