The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2015

Filed:

Nov. 16, 2012
Applicant:

Skyworks Solutions, Inc., Woburn, MA (US);

Inventor:

Kezia Cheng, Lowell, MA (US);

Assignee:

SKYWORKS SOLUTIONS, INC., Woburn, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 27/08 (2006.01); G01N 27/00 (2006.01); H01J 37/304 (2006.01); H01J 37/305 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
G01N 27/00 (2013.01); Y10T 29/41 (2015.01); H01J 37/304 (2013.01); H01J 37/3053 (2013.01); H01J 2237/30472 (2013.01); H01J 2237/3132 (2013.01); H01L 21/02 (2013.01);
Abstract

Disclosed herein are systems and methods for in-situ measurement of impurities on metal slugs utilized in electron-beam metal evaporation/deposition systems, and for increasing the production yield of a semiconductor manufacturing processes utilizing electron-beam metal evaporation/deposition systems. A voltage and/or a current level on an electrode disposed in a deposition chamber of an electron-beam metal evaporation/deposition system is monitored and used to measure contamination of the metal slug. Should the voltage or current reach a certain level, the deposition is completed and the system is inspected for contamination.


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