The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2015

Filed:

Jul. 25, 2005
Applicants:

Jay A. Morrison, Oviedo, FL (US);

Jay E. Lane, Mims, FL (US);

Gary B. Merrill, Orlando, FL (US);

Inventors:

Jay A. Morrison, Oviedo, FL (US);

Jay E. Lane, Mims, FL (US);

Gary B. Merrill, Orlando, FL (US);

Assignee:

SIEMENS ENERGY, INC., Orlando, FL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B21D 53/78 (2006.01); F01D 5/28 (2006.01); B23P 15/04 (2006.01); F01D 9/04 (2006.01);
U.S. Cl.
CPC ...
F01D 5/282 (2013.01); B23P 15/04 (2013.01); Y10T 29/49337 (2015.01); Y10T 29/49552 (2015.01); F01D 5/284 (2013.01); F01D 9/044 (2013.01); F05D 2240/30 (2013.01); F05D 2230/23 (2013.01);
Abstract

A method for joining a first CMC part () having an outer joining portion (), and a second CMC part () having an inner joining portion (). The second CMC part () is heat-cured to a stage of shrinkage more complete than that of the first CMC part () prior to joining. The two CMC parts () are joined in a mating interface that captures the inner joining portion () within the outer joining portion (). The assembled parts () are then fired together, resulting in differential shrinkage that compresses the outer joining portion () onto the inner joining portion (), providing a tightly pre-stressed joint. Optionally, a refractory adhesive () may be used in the joint. Shrinkage of the outer joining portion () avoids shrinkage cracks in the adhesive ().


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