The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2015
Filed:
Jan. 08, 2013
Applicants:
SK Hynix Inc., Icheon-si, KR;
Korea University Research and Business Foundation, Seoul, KR;
Inventors:
Dae Soon Lim, Seoul, KR;
Dong Hee Shin, Goyang-si, KR;
Dong Hyeon Lee, Seoul, KR;
Il Ho Yang, Icheon-si, KR;
Yang Bok Lee, Seoul, KR;
Assignees:
SK HYNIX INC., Icheon, KR;
KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION, Seoul, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01); H01L 21/461 (2006.01); C09K 13/00 (2006.01); H01L 21/306 (2006.01); C09K 3/14 (2006.01); C09G 1/02 (2006.01); H01L 21/321 (2006.01);
U.S. Cl.
CPC ...
C09K 13/00 (2013.01); H01L 21/30625 (2013.01); C09K 3/1463 (2013.01); C09G 1/02 (2013.01); H01L 21/3212 (2013.01);
Abstract
A polishing slurry for a chemical mechanical planarization process includes polishing particles and polyhedral nanoscale particles having a smaller size than the polishing particles and including a bond of silicon (Si) and oxygen (O).