The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2015
Filed:
Oct. 26, 2012
Applicant:
Taiyo Ink Mfg. Co., Ltd., Hiki-gun, JP;
Inventors:
Assignee:
TAIYO INK MFG. CO., LTD., Hiki-gun, JP;
Primary Examiner:
Int. Cl.
CPC ...
C08K 3/22 (2006.01); C08K 7/18 (2006.01); C08L 33/14 (2006.01); C08L 63/00 (2006.01); C08L 63/02 (2006.01); H05K 7/02 (2006.01); C09D 153/00 (2006.01); C08K 3/36 (2006.01); C08L 63/04 (2006.01); C09D 163/00 (2006.01); C09D 163/04 (2006.01); C08L 53/00 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
C09D 153/00 (2013.01); C08K 2003/2227 (2013.01); C08K 3/36 (2013.01); C08L 33/14 (2013.01); C08L 63/00 (2013.01); C08L 63/04 (2013.01); H05K 7/02 (2013.01); C09D 163/00 (2013.01); C09D 163/04 (2013.01); C08K 7/18 (2013.01); C08L 53/00 (2013.01); H05K 3/287 (2013.01); H05K 2201/0209 (2013.01);
Abstract
Provided are: a thermosetting resin composition in which a cured product is excellent in low warp properties, thermal cycle characteristics, and the like, and occurrence of cracking of a coating film in a B-stage state is suppressed; a cured product thereof; and a printed wiring board in which the cured product is used. The thermosetting resin composition comprises: (A) an epoxy resin; (B) a curing agent for an epoxy resin; (C) spherical silicon dioxide and/or spherical aluminum oxide; and (D) a block copolymer.