The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2015
Filed:
Oct. 17, 2013
Applicant:
Hitachi Chemical Company, Ltd., Chiyoda-ku, Tokyo, JP;
Inventors:
Assignee:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 3/22 (2006.01); C08K 3/38 (2006.01); C08L 63/00 (2006.01); C08L 63/02 (2006.01); C08L 63/04 (2006.01); C07D 307/89 (2006.01); C08K 3/18 (2006.01); C08K 3/00 (2006.01); C08K 7/26 (2006.01); C08K 7/28 (2006.01); C08L 63/06 (2006.01); C07D 307/77 (2006.01); C08G 59/42 (2006.01); C08G 69/26 (2006.01); C08L 67/02 (2006.01); H01L 33/56 (2010.01);
U.S. Cl.
CPC ...
C07D 307/89 (2013.01); C08K 3/18 (2013.01); C08K 3/0033 (2013.01); C08K 3/38 (2013.01); C08K 2003/222 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/2241 (2013.01); C08K 3/2279 (2013.01); C08K 7/26 (2013.01); C08K 7/28 (2013.01); C08L 63/04 (2013.01); C08L 63/06 (2013.01); C07D 307/77 (2013.01); C08G 59/4246 (2013.01); C08G 69/26 (2013.01); C08L 63/00 (2013.01); C08L 67/02 (2013.01); H01L 33/56 (2013.01);
Abstract
The epoxy resin molding material of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the (B) curing agent contains a polyvalent carboxylic acid condensate. The thermosetting resin composition of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the viscosity of the (B) curing agent is 1.0-1000 mPa·s at 150° C., as measured with an ICI cone-plate Brookfield viscometer.