The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2015
Filed:
Aug. 29, 2011
Applicants:
Hiroyuki Kurimura, Shibukawa, JP;
Isamu Ichikawa, Shibukawa, JP;
Yoshitsugu Goto, Shibukawa, JP;
Inventors:
Assignee:
DENKI KAGAKU KOGYO KABUSHIKI KAISHA, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 38/10 (2006.01); B32B 43/00 (2006.01); C09J 133/02 (2006.01); C09J 163/00 (2006.01);
U.S. Cl.
CPC ...
B32B 43/006 (2013.01); Y10T 156/1158 (2015.01); B32B 38/10 (2013.01); C08L 2312/00 (2013.01); C09J 133/02 (2013.01); C09J 163/00 (2013.01);
Abstract
Provided is a method for disassembling a bonded body, whereby the bonded body can be easily disassembled and peeled. The method for disassembling a bonded body formed by bonding substrates with an adhesive comprises irradiating light having a wavelength of 280 nm or more such that irradiation energy is 1000-5000000 mJ/cmat a wavelength of 365 nm while heating the bonded body to 150° C.-300° C.