The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2015

Filed:

Aug. 29, 2011
Applicants:

Uchenna Ofoma, San Gabriel, CA (US);

Bart Dean Hibbs, Simi Valley, CA (US);

Ronald Olch, Van Nuys, CA (US);

Justin B. Mcallister, Simi Valley, CA (US);

Inventors:

Uchenna Ofoma, San Gabriel, CA (US);

Bart Dean Hibbs, Simi Valley, CA (US);

Ronald Olch, Van Nuys, CA (US);

Justin B. McAllister, Simi Valley, CA (US);

Assignee:

AEROVIRONMENT, INC., Monrovia, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23P 15/26 (2006.01); F28D 9/00 (2006.01); F28F 3/02 (2006.01); H05K 7/20 (2006.01); H01L 23/34 (2006.01); H01L 23/467 (2006.01); B32B 9/00 (2006.01); B32B 37/14 (2006.01); B32B 5/18 (2006.01); B32B 33/00 (2006.01); B64D 13/00 (2006.01); F28F 3/00 (2006.01); F28F 21/02 (2006.01); B64D 13/06 (2006.01);
U.S. Cl.
CPC ...
B23P 15/26 (2013.01); B32B 9/005 (2013.01); B32B 9/007 (2013.01); B32B 37/142 (2013.01); B32B 2307/302 (2013.01); B32B 5/18 (2013.01); B32B 33/00 (2013.01); B32B 2605/18 (2013.01); B64D 13/006 (2013.01); F28D 9/0025 (2013.01); F28D 9/0081 (2013.01); F28F 3/005 (2013.01); F28F 3/027 (2013.01); F28F 21/02 (2013.01); F28F 2245/04 (2013.01); Y10T 29/4935 (2015.01); B64D 2013/0614 (2013.01); H05K 7/20509 (2013.01); H01L 23/34 (2013.01); H01L 23/467 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A method of manufacturing a heat transfer system is provided that includes, in one form, preparing a heat conducting array by perforating at least a portion of the heat conducting array, placing the heat conducting array around foam elements, placing a heat conducting spreader along one surface area of the foam elements, placing a lower skin over the heat conducting spreader, placing an upper skin over an opposite surface area of the foam elements to create a structural assembly, and curing the structural assembly. A material of the foam elements flows through the perforated portion of the heat conducting array during the curing step.


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