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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9066432 B1

PDFFull Text
Date of Patent:
Jun. 23, 2015

Filed:

Nov. 17, 2010

Copper foil for printed wiring board

Applicants:

Koichiro Tanaka, Hitachi, JP;

Misato Chuganji, Hitachi, JP;

Inventors:

Koichiro Tanaka, Hitachi, JP;

Misato Chuganji, Hitachi, JP;

Assignee:

JX Nippon Mining & Metals Corporation, Tokyo, JP;

Attorney:

Drinker Biddle & Reath LLP

Primary Examiner:

Cathy Lam

Int. Cl.
CPC ...
B32B 15/08 (2006.01); H05K 1/09 (2006.01); C23C 14/16 (2006.01); C23C 28/02 (2006.01); H05K 3/38 (2006.01); C23C 26/00 (2006.01); H05K 1/03 (2006.01); H05K 3/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/09 (2013.01); Y10T 428/12438 (2015.01); Y10T 428/12569 (2015.01); Y10T 428/12819 (2015.01); Y10T 428/1291 (2015.01); C23C 14/165 (2013.01); C23C 28/023 (2013.01); H05K 1/0393 (2013.01); H05K 3/022 (2013.01); H05K 3/384 (2013.01); C23C 26/00 (2013.01);
Abstract

Provided is a copper foil for a printed wiring board, the copper foil being suitable for achieving finer pitch, favorable in terms of manufacturing cost, and excellent both in etching ability and adhesion to an insulating substrate. The copper foil for a printed wiring board comprises a copper foil base material and a covering layer for covering at least a portion of a surface of the copper foil base material, wherein the covering layer is formed by an nickel-vanadium alloy layer containing nickel and vanadium, and a chromium layer, laminated in this order from the surface of the copper foil base material; the chromium layer contains chromium in an amount of 15-210 μg/dm; the nickel-vanadium alloy layer contains nickel and vanadium in a combined covering amount of 20-600 μg/dm; and the nickel-vanadium alloy layer contains vanadium in an amount of 3-70 wt %.

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Tanaka, Koichiro. (2015). Copper foil for printed wiring board (U.S. Patent No. 9066432). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9066432

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