The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2015

Filed:

Jan. 04, 2011
Applicant:

Osamu Shimada, Tokyo, JP;

Inventor:

Osamu Shimada, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/06 (2006.01); H05K 1/02 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H05K 1/18 (2006.01); H05K 3/46 (2006.01); H01L 23/31 (2006.01); H05K 3/40 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/023 (2013.01); H01L 21/486 (2013.01); H01L 23/3121 (2013.01); H01L 23/49827 (2013.01); H01L 23/5383 (2013.01); H01L 23/5389 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/01079 (2013.01); H05K 1/0224 (2013.01); H05K 1/186 (2013.01); H05K 3/4069 (2013.01); H05K 3/4614 (2013.01); H05K 3/4647 (2013.01); H05K 2201/0355 (2013.01); H05K 2201/10636 (2013.01); H05K 2203/061 (2013.01); H05K 2203/063 (2013.01); H01L 24/48 (2013.01); H01L 2924/3025 (2013.01);
Abstract

In an electronic component in which a semiconductor chip (semiconductor element) and a passive component are integrated on a multilayer wiring board and the semiconductor chip and the passive component constitute a feedback circuit, an input end and an output end of the semiconductor chip (semiconductor element) are electrically separated from each other. The electronic component includes the multilayer wiring board, the semiconductor chip disposed on the main surface of or inside the multilayer wiring board, and the passive component having a first terminal and a second terminal connected to the input end and the output end of the semiconductor chip respectively, and is configured such that a conductive member constituting the multilayer wiring board is located at a position where a distance from at least one of the first terminal and the second terminal is smaller than a distance between the first terminal and the second terminal.


Find Patent Forward Citations

Loading…