The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2015

Filed:

Mar. 20, 2013
Applicant:

Ngk Spark Plug Co., Ltd., Nagoya, Aichi, JP;

Inventor:

Shinnosuke Maeda, Nagoya, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/02 (2006.01); H05K 3/46 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/02 (2013.01); H05K 3/421 (2013.01); H05K 3/4644 (2013.01); H05K 2201/09509 (2013.01); H05K 2201/0959 (2013.01); H05K 2201/2072 (2013.01); H05K 2201/029 (2013.01);
Abstract

To provide a multilayer wiring board that ensures sufficient close contact strength between a conformal type conductor and a resin insulating layer. A multilayer wiring board includes a multilayered construction where a plurality of resin insulating layers and a plurality of conductor layers are alternately layered. In each of a plurality of via holes formed in the resin insulating layers, a conformal via conductor is formed to electrically connect between the conductor layers. Filling up parts of the resin insulating layers layered at upper layer side inside of the conformal via conductor forms an anchor portion. The lower end side of the anchor portion bulges larger than the upper end side in the radially outward direction of the via hole.


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