The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2015

Filed:

Jul. 24, 2012
Applicants:

Jae Woo Lee, Daejeon, KR;

Chang Han Je, Daejeon, KR;

Woo Seok Yang, Daejeon, KR;

Jong Dae Kim, Daejeon, KR;

Inventors:

Jae Woo Lee, Daejeon, KR;

Chang Han Je, Daejeon, KR;

Woo Seok Yang, Daejeon, KR;

Jong Dae Kim, Daejeon, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 31/00 (2006.01); H04R 19/00 (2006.01); H04R 19/04 (2006.01);
U.S. Cl.
CPC ...
H04R 19/005 (2013.01); Y10T 29/49005 (2015.01); H04R 31/00 (2013.01); H04R 19/04 (2013.01);
Abstract

A method for fabricating an acoustic sensor according to an exemplary embodiment of the present disclosure includes: forming an acoustic sensor unit by forming a lower electrode on an upper portion of a substrate, forming etching holes on the lower electrode, forming a sacrifice layer on an upper portion of the lower electrode, and coupling a diaphragm to an upper portion of the sacrifice layer; coupling a lower portion of the substrate of the acoustic sensor unit to a printed circuit board on which a sound pressure input hole is formed so as to expose the lower portion of the substrate of the acoustic sensor unit to the outside through the sound pressure input hole; attaching a cover covering the acoustic sensor unit on the printed circuit board; etching the substrate of the acoustic sensor unit to form an acoustic chamber; and removing the sacrifice layer.


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