The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2015

Filed:

Jun. 29, 2011
Applicants:

Dieter Holste, Detmold, DE;

Ulrich Rosemeyer, Schieder Schwalenberg, DE;

Inventors:

Dieter Holste, Detmold, DE;

Ulrich Rosemeyer, Schieder Schwalenberg, DE;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01R 43/16 (2006.01); H05K 3/34 (2006.01); H01B 1/02 (2006.01);
U.S. Cl.
CPC ...
H01R 43/16 (2013.01); Y10T 29/49204 (2015.01); H01L 23/49555 (2013.01); H01L 23/49582 (2013.01); H05K 3/3426 (2013.01); H05K 2201/1031 (2013.01); H05K 2201/10984 (2013.01); H01B 1/02 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A connecting contact for SM D-components includes a metal material and the metal material at least partially comprises a coating with a different metal material. The connecting contact has a substantially laminar contact area for solderable contact to a board and comprises edge regions. At least one segment of the edge region is at a distance from the laminar contact area, so that a soldered fillet is formed for a soldered contact to a board. Also, a method for producing connecting contacts for SM D-components for solderably contacting a board includes the steps of punching metal strips, bending the metal strips so that a conducting region and a laminar contact area are produced, and forming the edge areas at the laminar contact area. At least one segment of the edge area is at a distance from the laminar contact area.


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