The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2015

Filed:

Mar. 27, 2014
Applicants:

Japan Aviation Electronics Industry, Limited, Shibuya-ku, Tokyo, JP;

Jae Electronics, Inc., Irvine, CA (US);

Inventors:

Takayuki Nishimura, Tokyo, JP;

Daisuke Machihara, Irvine, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/00 (2006.01); H01R 12/79 (2011.01); H01R 12/70 (2011.01); H01R 12/71 (2011.01); H01R 12/77 (2011.01);
U.S. Cl.
CPC ...
H01R 12/79 (2013.01); H01R 12/7082 (2013.01); H01R 12/716 (2013.01); H01R 12/775 (2013.01);
Abstract

A connector is mateable with a mating connector along an up-down direction under a mounted state where the connector is mounted on a circuit board. The mating connector is mounted on a mating circuit board. The connector comprises a housing, a regulation member and a contact. The regulation member has an insulation portion and a metal portion. The insulation portion is supported by the metal portion. The metal portion is fixed to the housing. The contact is press-fit in the housing from below to be held by the housing. The contact has a connection portion and a resilient portion. The connection portion is fixed to an upper surface of the circuit board under the mounted state. The resilient portion has a lower-end portion. The lower-end portion of the resilient portion is located below the connection portion and located right above the insulation portion. The resilient portion is resiliently deformable downward.


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