The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2015

Filed:

Dec. 16, 2013
Applicant:

Toyoda Gosei Co., Ltd., Kiyosu-shi, JP;

Inventors:

Satoshi Wada, Kiyosu, JP;

Kosei Fukui, Kiyosu, JP;

Toshimasa Hayashi, Kiyosu, JP;

Takashi Nonogawa, Kiyosu, JP;

Assignee:

Toyoda Gosei, Co., Ltd., Kiyosu-shi, Aichi-ken, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/64 (2010.01); H01L 33/50 (2010.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 33/505 (2013.01); H01L 33/644 (2013.01); H01L 2933/0075 (2013.01); H01L 24/73 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/13 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/12041 (2013.01);
Abstract

The present invention provides a light emitting device, which includes a light emitting diode (LED) chip, a wavelength conversion plate including a fluorescent substance and disposed on a light output surface side of the LED chip, and a sub heat radiation path formed to radiate heat of the wavelength conversion plate. The sub heat radiation path includes a transparent heat-conductive film provided on a surface of the wavelength conversion plate, a heat radiator provided in the vicinity of the LED chip, and a thermal connection member that thermally connects the transparent heat-conductive film to the heat radiator.


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