The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2015

Filed:

Feb. 18, 2014
Applicant:

Eastman Chemical Company, Kingsport, TN (US);

Inventors:

Marcus David Shelby, Fall Branch, TN (US);

David B. Calvert, Kingsport, TN (US);

Freddie Wayne Williams, Kingsport, TN (US);

Scott Allen Clear, Escondido, CA (US);

Peter Borden Mackenzie, Kingsport, TN (US);

Candace Michele Tanner, Kingsport, TN (US);

Jennifer Lynne Stikeleather-Peavey, Raleigh, NC (US);

Jeffrey Todd Owens, Kingsport, TN (US);

Assignee:

Eastman Chemical Company, Kingsport, TN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 35/28 (2006.01); H01L 35/04 (2006.01); B29C 61/02 (2006.01); H01L 35/34 (2006.01); B32B 3/28 (2006.01); F25B 21/02 (2006.01); H01L 35/30 (2006.01); H01L 35/32 (2006.01);
U.S. Cl.
CPC ...
H01L 35/04 (2013.01); B29C 61/02 (2013.01); H01L 35/34 (2013.01); B32B 3/28 (2013.01); F25B 21/02 (2013.01); H01L 35/30 (2013.01); H01L 35/32 (2013.01);
Abstract

Self-corrugating laminates useful in the manufacture of thermoelectric devices are disclosed. The laminates include an upper and a lower shrinkable film layer and a non-shrinkable core with a thermoelectric pattern formed thereon bonded between said upper and lower shrinkable film along bond lines arranged parallel, substantially parallel, radially, or annularly. The bond lines that bond the upper shrinkable film layer to top surface of the nonshrinkable core are staggered relative to the bond lines that bond the lower shrinkable film layer to the bottom surface of the non-shrinkable core such that upon shrinkage of the shrinkable film layers, structural corrugations are formed in the non-shrinkable core. Thermoelectric modules or devices and methods for forming them from the self-corrugating laminates are also described.


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