The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2015
Filed:
Aug. 25, 2011
Applicants:
Thorsten Meyer, Regensburg, DE;
Klaus Reingruber, Singapore, SG;
David O'sullivan, Sinzing, DE;
Inventors:
Assignee:
Intel Mobile Communications GmbH, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/568 (2013.01); H01L 23/3185 (2013.01); H01L 23/3157 (2013.01); H01L 23/3121 (2013.01); H01L 23/3107 (2013.01); H01L 21/56 (2013.01); H01L 21/561 (2013.01); H01L 24/19 (2013.01); H01L 24/96 (2013.01); H01L 2924/01029 (2013.01); H01L 2224/73267 (2013.01); H01L 24/20 (2013.01); H01L 2224/12105 (2013.01); H01L 2924/1461 (2013.01);
Abstract
A method of manufacturing a device includes providing a semiconductor chip having a first face and a second face opposite to the first face with a contact pad arranged on the first face. The semiconductor chip is placed on a carrier with the first face facing the carrier. The semiconductor chip is encapsulated with an encapsulation material. The carrier is removed and the semiconductor material is removed from the second face of the first semiconductor chip without removing encapsulation material at the same time.