The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2015
Filed:
Jul. 27, 2007
Applicant:
Kouichi Nagai, Kawasaki, JP;
Inventor:
Kouichi Nagai, Kawasaki, JP;
Assignee:
FUJITSU SEMICONDUCTOR LIMITED, Yokohama, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); H01L 21/66 (2006.01); G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); G01R 31/2891 (2013.01); H01L 22/20 (2013.01); H01L 2223/5442 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/5446 (2013.01);
Abstract
The present invention provides a semiconductor wafer characterized by including: a silicon substrate which includes chip regions and scribe regions; multiple-layered films formed on the silicon substrate; and a reference mark formed in at least one film constituting the multiple-layered films. In addition, the semiconductor wafer is also characterized in that the reference mark is located at least one of the vertices of a virtual rectangle covering the plurality of chip regions, and in that the reference mark is longer than one side of each of the chip regions.