The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2015
Filed:
Jul. 25, 2014
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Junjing Bao, San Diego, CA (US);
Elbert E. Huang, Carmel, NY (US);
Yan Zun Li, Lagrangeville, NY (US);
Dan Moy, Bethel, CT (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 21/82 (2006.01); H01L 23/525 (2006.01); H01L 23/522 (2006.01); H01L 21/768 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5256 (2013.01); H01L 23/5226 (2013.01); H01L 23/53223 (2013.01); H01L 23/53238 (2013.01); H01L 23/53266 (2013.01); H01L 23/53295 (2013.01); H01L 21/76832 (2013.01); H01L 21/76834 (2013.01); H01L 21/76849 (2013.01); H01L 2924/0002 (2013.01);
Abstract
An electronic fuse structure including a first Mmetal comprising a conductive cap, an Mmetal located above the Mmetal, wherein the Mmetal does not comprise a conductive cap, and a via, wherein the via electrically connects the Mmetal to the Mmetal in a vertical orientation.