The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2015

Filed:

Feb. 19, 2014
Applicant:

Denso Corporation, Kariya, Aichi-pref., JP;

Inventor:

Shuji Yoneda, Chiryu, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/482 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4822 (2013.01); H01L 2924/0002 (2013.01); H01L 25/0655 (2013.01);
Abstract

A semiconductor device includes a semiconductor chip, multiple terminals arranged in a first direction, a resin portion sealing the semiconductor chip and the terminals. The terminals are projected from a side surface of the resin portion in a second direction, and include at least one subject terminal having a first portion and a second portion. In the subject terminal, a first longitudinal end of the first portion is positioned inside of the resin portion and a second longitudinal end of the first portion is positioned outside of the resin portion, and the second portion is arranged adjacent to the first portion. Further, a length of the first portion is greater than a length of the second portion in the third direction, and a length of the first portion is smaller than a length of the second portion in the first direction.


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