The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2015
Filed:
Nov. 13, 2007
Applicants:
Joerg Dorn, Buttenheim, DE;
Thomas Kuebel, Erlangen, DE;
Inventors:
Joerg Dorn, Buttenheim, DE;
Thomas Kuebel, Erlangen, DE;
Assignee:
Siemens Aktiengesellschaft, Munich, DE;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 25/11 (2006.01); H01L 23/40 (2006.01); H01L 23/58 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H01L 25/117 (2013.01); H01L 23/4012 (2013.01); H01L 25/071 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A power semiconductor module includes at least two power semiconductor units that are interconnected and that have controllable semiconductors. Each semiconductor unit is associated with a cooling plate to which the semiconductors are connected in a heat-conducting manner. The object is to provide a semiconductor module that is compact and cost-effective and at the same time explosion-proof. The power semiconductor module of the invention has a module housing which houses the power semiconductor units. The cooling plates form at least part of the module housing.