The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2015
Filed:
Sep. 27, 2013
Applicant:
Tyco Electronics Corporation, Berwyn, PA (US);
Inventors:
George Jyh-Shann Chou, Mechanicsburg, PA (US);
Robert Daniel Hilty, Sunnyvale, CA (US);
Assignee:
TYCO ELECTRONICS CORPORATION, Berwyn, PA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/01 (2006.01); H01B 1/02 (2006.01); C23C 28/02 (2006.01);
U.S. Cl.
CPC ...
H01B 1/02 (2013.01); Y10T 428/12722 (2015.01); Y10T 428/12944 (2015.01); Y10T 428/12889 (2015.01); Y10T 428/12479 (2015.01); Y10T 428/12715 (2015.01); C23C 28/02 (2013.01); C23C 28/023 (2013.01); C23C 28/028 (2013.01);
Abstract
An electrical conductor has a metal substrate. A seal layer is provided exterior of the metal substrate. A nickel layer is provided exterior of the seal layer. The seal layer is a non-nickel based metal. Optionally, the seal layer may be tin based. Optionally, the seal layer may create intermetallic interface layers with the nickel layer and the metal substrate. Optionally, the electrical conductor may constitute a contact configured for mating with at least one of a printed circuit board or another mating contact.