The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2015

Filed:

Oct. 08, 2004
Applicants:

Gregory Remy Philippe Conti, Saint Paul, FR;

Jerome Laurent Azema, Villeneuve-Loubet, FR;

Jerome Neanne, Nice, FR;

Inventors:

Gregory Remy Philippe Conti, Saint Paul, FR;

Jerome Laurent Azema, Villeneuve-Loubet, FR;

Jerome Neanne, Nice, FR;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 12/14 (2006.01); G06F 21/74 (2013.01);
U.S. Cl.
CPC ...
G06F 12/1433 (2013.01); G06F 21/74 (2013.01);
Abstract

A computing system comprising a processor having a first and second bus (the processor on a first semiconductor die mounted within a semiconductor package), a monitoring device coupled to both the first and second bus of the processor (the monitoring device on the first semiconductor die mounted within the semiconductor package), a memory coupled to the processor via the first bus (coupled to the monitoring device via a security signal, the memory on a second semiconductor die mounted within the semiconductor package), and a user interface external of the semiconductor package (the user interface coupled to the processor via the second data and instruction bus). The monitoring device checks one or both of the first and second busses to determine whether a secure mode entry sequence is delivered to the processor. The first bus and the security signal are only coupled to and accessible by devices within the semiconductor package.


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