The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2015

Filed:

Sep. 15, 2011
Applicants:

Casey J. Feinstein, San Jose, CA (US);

John Z. Zhong, Cupertino, CA (US);

Lynn R. Youngs, Cupertino, CA (US);

Stephen S. Poon, San Jose, CA (US);

Inventors:

Casey J. Feinstein, San Jose, CA (US);

John Z. Zhong, Cupertino, CA (US);

Lynn R. Youngs, Cupertino, CA (US);

Stephen S. Poon, San Jose, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/02 (2006.01); H05K 3/10 (2006.01); G06F 3/041 (2006.01); G02F 1/1333 (2006.01); G06F 3/044 (2006.01); H01L 27/12 (2006.01); G02F 1/1368 (2006.01);
U.S. Cl.
CPC ...
G06F 3/0416 (2013.01); Y10T 29/49155 (2015.01); G02F 1/1333 (2013.01); G02F 1/1368 (2013.01); G06F 3/044 (2013.01); H01L 27/1266 (2013.01);
Abstract

A method of fabricating a display panel from a thin substrate using a carrier substrate is disclosed. The method includes depositing a bonding agent on a first surface of the thin substrate; depositing a bonding agent on a second surface of the carrier substrate; bonding the thin substrate and the carrier substrate with the bonding agent deposited on the first surface and the second surface; performing thin film processing on a third surface of the thin substrate opposite the first surface; and separating the processed thin substrate from the carrier substrate. The thin substrate has a thickness less than a required thickness for sustaining thin film processing while a thickness of the bonded thin substrate and the carrier substrates is greater than or equal to that the required thickness.


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