The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2015

Filed:

Apr. 22, 2013
Applicant:

Avago Technologies General Ip (Singapore) Pte. Ltd., Singapore, SG;

Inventor:

Marco Scofet, Rivarolo Canavese, IT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 10/02 (2006.01); G02B 6/42 (2006.01); H04B 10/25 (2013.01); H04B 10/40 (2013.01); H04B 10/00 (2013.01);
U.S. Cl.
CPC ...
G02B 6/4281 (2013.01); H04B 10/25 (2013.01); H04B 10/40 (2013.01); G02B 6/4253 (2013.01);
Abstract

An optoelectronic module for data communication through an optical fiber. The optoelectronic module may comprise a base, an outer cap, an inner cap, a flexible substrate, an attachment member, a moisture barrier and an optoelectronic module. The outer cap may have a first cavity and coupled with the base. A slit may be formed on the outer cap. The flexible substrate may be extended through the slit of the outer cap. The inner cap may be disposed within the first cavity. The inner cap may comprise a second cavity. The attachment member may be disposed within the first cavity and configured to attach the inner cap to the base. The moisture barrier may be disposed within the first cavity and encapsulates the attachment member. The optoelectronic component may be disposed within the second cavity and proximate to the flexible substrate.


Find Patent Forward Citations

Loading…