The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2015
Filed:
Dec. 07, 2011
Applicants:
Gnitaboure Yabre, Mainvilliers, FR;
Yves Stricot, Villepreux, FR;
Inventors:
Gnitaboure Yabre, Mainvilliers, FR;
Yves Stricot, Villepreux, FR;
Assignee:
FCI, Guyancourt, FR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 1/14 (2006.01); H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
G02B 6/4269 (2013.01); Y10T 29/49139 (2015.01); G02B 6/4206 (2013.01); G02B 6/4214 (2013.01); G02B 6/428 (2013.01); H05K 1/021 (2013.01); H05K 1/0274 (2013.01); H05K 1/141 (2013.01); H05K 1/183 (2013.01); H05K 2201/09845 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10416 (2013.01); H05K 2201/10674 (2013.01); H05K 3/306 (2013.01);
Abstract
Printed circuit board assembly including an optical subassembly having a carrying face for carrying at least one optoelectronic component in a such way that light emitted from/directed to is transmitted through the optical subassembly; a printed circuit board having a supporting area for supporting the optical subassembly; wherein the printed circuit board supporting area includes a hole lodging at least one part of the optoelectronic component and wherein at least one part of the carrying face is fixed by flip-chip bonding to at least one part of the supporting area.