The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2015
Filed:
Apr. 08, 2013
Hon Hai Precision Industry Co., Ltd., New Taipei, TW;
Terrance F. Little, Fullerton, CA (US);
Yuan-Chieh Lin, Lake Forest, CA (US);
Jun-Bin Huang, Eastvale, CA (US);
Jim Zhao, Irvine, CA (US);
Gang Paul Chen, Walnut, CA (US);
Jie Zheng, Rowland-Heights, CA (US);
Ji Li, West Covina, CA (US);
An-Jen Yang, Irvine, CA (US);
HON HAI PRECISION INDUSTRY CO., LTD., New Taipei, TW;
Abstract
An object of the present invention is to provide a new modular SLC (Surface Laminar Circuit) interconnect system for replacing the traditional ceramic substrate implanted with 56 Duece modules, the interconnect system includes an organizer for accurately positioning the connector assemblies, and a plurality of fully populated connector housings defining a pitch same as that defined by the Duece modules. Each connector housing defines two receiving slots to receive two SLC modules which are further commonly held by a heat sink above. Each SLC module is equipped with a plurality of micro-controllers, a plurality of OE glass lenses, a plurality of IC chips, and a molded lens and fiber able assembly.