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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9062846 B1

PDFFull Text
Date of Patent:
Jun. 23, 2015

Filed:

Sep. 14, 2012

Linear light source apparatus

Applicants:

Kinji Hayashi, Kiyosu, JP;

Hitoshi Omori, Kiyosu, JP;

Inventors:

Kinji Hayashi, Kiyosu, JP;

Hitoshi Omori, Kiyosu, JP;

Assignee:

Toyoda Gosei, Co., Ltd., Kiyosu-Shi, Aichi-Ken, JP;

Attorney:

McGinn IP Law Group, PLLC

Primary Examiner:

Thomas M Sember

Int. Cl.
CPC ...
F21V 7/00 (2006.01); F21V 29/00 (2015.01); F21V 21/005 (2006.01); F21K 99/00 (2010.01); F21S 4/00 (2006.01); F21V 7/04 (2006.01); F21V 17/06 (2006.01); H01L 33/00 (2010.01); H05K 1/02 (2006.01); F21Y 101/02 (2006.01); F21Y 103/00 (2006.01); H05K 3/00 (2006.01); H05K 3/28 (2006.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
F21V 7/00 (2013.01); F21V 29/00 (2013.01); F21V 21/005 (2013.01); F21V 29/004 (2013.01); F21K 9/00 (2013.01); F21S 4/008 (2013.01); F21V 7/04 (2013.01); F21V 17/06 (2013.01); H01L 33/00 (2013.01); F21Y 2101/02 (2013.01); F21Y 2103/003 (2013.01); H05K 1/0271 (2013.01); H05K 3/0061 (2013.01); H05K 3/284 (2013.01); H05K 2201/09036 (2013.01); H05K 2201/10106 (2013.01); H05K 2203/1316 (2013.01); H05K 2203/1327 (2013.01); H01L 25/0753 (2013.01);
Abstract

The linear light source apparatus includes an elongated rectangular wiring substrate; a plurality of light-emitting devices which are aligned on a straight line on the top surface of the wiring substrate; reflectors provided on the top surface such that each reflector corresponds to one light-emitting device; a sealing resin portion which seals each of the light-emitting devices; and a heat radiation sheet provided on the bottom surface of the wiring substrate. A plurality of grooves are provided on the bottom surface of the substrate. Each groove is formed so as to have a line shape and to extend in a lateral direction of the wiring substrate. Each of the grooves is located between adjacent light-emitting devices. The heat radiation sheet is provided on the entire bottom surface of the wiring substrate.

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