The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2015
Filed:
Nov. 01, 2010
Applicant:
Alexandra Wirth, Eckental, DE;
Inventor:
Alexandra Wirth, Eckental, DE;
Assignee:
BASF AKTIENGESELLSCHAFT, Ludwigshafen, DE;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); C23C 10/50 (2006.01); C23C 18/50 (2006.01); H01L 21/288 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
C23C 18/50 (2013.01); H01L 21/288 (2013.01); H01L 23/53238 (2013.01); H01L 21/76843 (2013.01); H01L 21/76849 (2013.01); H01L 2924/0002 (2013.01);
Abstract
The present invention relates to the use of ternary nickel-containing metal alloys of the NiMR type (where M=Mo, W, Re or Cr, and R=B or P) deposited by an electroless process in semiconductor technology. In particular, the present invention relates to the use of these deposited ternary nickel-containing metal alloys as barrier material or as selective encapsulation material for preventing the diffusion and electromigration of copper in semiconductor components.