The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2015
Filed:
Dec. 14, 2010
Applicant:
Shigeo Nakamura, Kawasaki, JP;
Inventor:
Shigeo Nakamura, Kawasaki, JP;
Assignee:
AJINOMOTO CO., INC., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); C08J 5/24 (2006.01); B32B 7/12 (2006.01); C08G 59/24 (2006.01); C08L 63/00 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
C08J 5/24 (2013.01); Y10T 428/287 (2015.01); B32B 7/12 (2013.01); B32B 2559/00 (2013.01); B32B 2605/08 (2013.01); C08G 59/245 (2013.01); C08J 2363/00 (2013.01); C08J 2379/04 (2013.01); C08L 63/00 (2013.01); H05K 1/0373 (2013.01); H05K 3/4676 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/0133 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/0212 (2013.01);
Abstract
A resin composition which is low in a roughness of an insulating layer surface and capable of forming thereon a plated conductor layer having a sufficient peel strength in a wet roughing step and which is excellent in dielectric characteristics and a coefficient of thermal expansion, is disclosed. The resin composition contains a cyanate ester resin and a specified epoxy resin.