The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2015

Filed:

Sep. 06, 2013
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon, Gyunggi-do, KR;

Inventors:

Kum Jin Park, Gyungg-do, KR;

Sang Hyuk Kim, Gyunggi-do, KR;

Hye Young Baeg, Gyunggi-do, KR;

Hyung Joon Jeon, Gyunggi-do, KR;

Sang Hoon Kwon, Gyunggi-do, KP;

Chang Hak Choi, Gyunggi-do, KR;

Assignee:

SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon, Gyunggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C04B 35/468 (2006.01); B82Y 30/00 (2011.01); C04B 35/49 (2006.01); H01C 7/00 (2006.01); H01C 17/065 (2006.01); H01G 4/12 (2006.01); H01G 4/30 (2006.01); C01G 23/00 (2006.01); C01G 23/053 (2006.01); C04B 35/624 (2006.01);
U.S. Cl.
CPC ...
C04B 35/4682 (2013.01); B82Y 30/00 (2013.01); C04B 35/49 (2013.01); C04B 2235/3224 (2013.01); C04B 2235/3225 (2013.01); C04B 2235/3244 (2013.01); C04B 2235/5296 (2013.01); C04B 2235/5445 (2013.01); C04B 2235/5454 (2013.01); C04B 2235/5463 (2013.01); C04B 2235/765 (2013.01); H01C 7/008 (2013.01); H01C 17/06533 (2013.01); H01G 4/1245 (2013.01); H01G 4/30 (2013.01); C01G 23/003 (2013.01); C01G 23/006 (2013.01); C01G 23/053 (2013.01); C01G 23/0536 (2013.01); C01P 2002/34 (2013.01); C01P 2002/77 (2013.01); C01P 2004/03 (2013.01); C01P 2004/04 (2013.01); C01P 2004/32 (2013.01); C01P 2004/51 (2013.01); C01P 2004/62 (2013.01); C01P 2004/64 (2013.01); C01P 2006/12 (2013.01); C01P 2006/14 (2013.01); C04B 35/624 (2013.01);
Abstract

There are provided a method of manufacturing perovskite powder, and perovskite powder and a multilayer ceramic electronic component manufactured thereof. The manufacturing method includes: washing metal oxide hydrate to remove impurities therefrom; adding pure water and an acid or a base to the metal oxide hydrate to prepare a metal oxide sol; mixing the metal oxide sol with a metal salt to form perovskite particle nuclei; and conducting grain growth of the perovskite particle nuclei by hydrothermal treatment to produce perovskite powder. The method of manufacturing perovskite powder and the perovskite powder manufactured by the same have advantages such as excellent crystallinity, reduced generation of fine powder, and favorable dispersion properties.


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